活动简介：

金属基复合材料电子系统散热

报告摘要：

Increasing power densities within microelectronic systems places an ever increasing demand on the thermal management. Thermal interface materials (TIMs) are used to fill air gaps at the interface between two materials, greatly increasing the thermal conductance when solid surfaces are attached together. The last decade has provided significant development on high performing TIMs. This talk presents recent development and progress on metal matrix polymer fiber thermal interface material as a novel approach to address electronics cooling applications. The talk will mainly cover the study of the effect of using polymer fibers, carbon fibers and graphene fibers as the reinforcement in the metal matrix system to enhance mechanical and thermal properties.

报告人简历：

Dr. Johan Liu graduated with a master and a Ph.D. degree in materials science from the Royal Institute of Technology, Sweden As a member of the Royal Swedish Academy of Engineering Sciences and a fellow of IEEE, he has published 500 papers in journals, conference proceedings and book chapters. He has 75 patents accepted or filed and has published 35 papers with impact factor over 3,5 (8 of them over 10) including those in Nature Communications, Advanced Materials and so on. His research field covers mainly nanoelectronics, microsystems packaging and 3D additive manufacturing materials and processes including vertical stacking CNT TSV technology, CNT/graphene assisted cooling technology, graphene heat spreader, high temperature stable conductive adhesives, nano-soldering, nano-thermal interface materials and biomedical nanoscaffolds.